multi-function laboratory plasma wafer cleaning

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1 Set/Sets (Min. Order)
Supply Ability:
20 Set/Sets per Month
Port:
Shanghai
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Overview
Quick Details
Machine Type:
Other
Condition:
New
Place of Origin:
Anhui, China (Mainland)
Brand Name:
HB
Model Number:
HB-PCL-10L-B
Feature:
Critical Cleaning / Residue Free
Certification:
CE, UL
Use:
surface modification treatment of substrate, granular material
Cleaning Type:
plasma cleaning
Industry Used:
Electronic Industry
Material:
Glass / Ceramic
Power(W):
200-400W
After-sales Service Provided:
Engineers available to service machinery overseas
Name:
wafer cleaning
capacity:
10L
frequency offset:
less than 0.2 khz
display mode:
LCD
Gas flow:
10-100ml/min
Packaging & Delivery
Packaging Details
wooden case
Delivery Time
Prompt delivery

Multi-function laboratory plasma wafer cleaning

 

Application of wafer cleaning

1.Car industry: ignition coil engine oil seal film
2.Defense industry: Aerospace electrical connectors,Kevlar deal
3.Electronics industry: hard plastic parts, earphone, Cell phone cover
4.Medical industry: intravenous infusion, catheter treatment
5.Textile fiber,rubber and plastic industry and etc

 

Featrues of wafer cleaning

1. Environmental technologies: plasma process is the role of gas - solid coherent reactor consumes no water resources, no need to add chemicals and no environmental pollution.
2. Wide adaptability: 
regardless of processing substrate type, such as metals, semiconductors, oxides, and most of the polymer material can be a good deal;
3. Low temperature: 
close to room temperature, particularly suitable polymer materials, have a longer retention time and a higher surface tension than the corona and flame method.
4. Multifunctions: 
it involves only a shallow surface of polymer materials (10 -1000A), while preserving the characteristics of the material itself can give it one or more  new features;
5. Low cost: 
the device is simple, easy operation and maintenance, continuous operation,a few bottles of gas can replace thousands of kilograms cleaning fluid
6. The whole process technology can be controlled: 
all the parameters can be setted by the computer and data recording
7. Treated geometry Unlimited: 
Big or small, simple or complex, parts or textiles can be processed.

 

Technical parmaters of wafer cleaning

 

Model HB-PCL-10L-B
Working current:Total working current not higher than 2A (Not include the vacuum pump)
RF frequency13.56MHz
RF power200-400W
Frequency offset<0.4KHz
Vacuum degree60Pa-100Pa
Cleaning time1-6000s adjustable
Gas flow>10-100ml
Process Controlmanually/automatic
Power10-100%adjustable
Cleaning capacity10L
Exhaust pipeKF vacuum flange+vacuum aluminum pipe
Vacuum PumpBipolar direct rotary vane pump
Impedance matchingautomatic
DisplayLCD
Power supplyAC 220V 60Hz